TY  - CONF

T1  - Package-related degradation condition monitoring of SiC power MOSFETs using current distribution anomaly detection

JO  - IET Conference Proceedings

UR  - https://doi.org/10.1049/icp.2022.1145

PY  - 2022/07/05

AU  - Naghibi J

AU  - Mohsenzade S

AU  - Mehran K

AU  - Foster MP

ED  - 

DO  - DOI: 10.1049/icp.2022.1145

PB  - Institution of Engineering and Technology (IET)

VL  - 2022

IS  - 4

SP  - 728

EP  - 732

Y2  - 2025/11/23

ER  -