TY  - JOUR

T1  - Effect of temperature and storage environment on the preservation of copper surfaces for fluxless soldering

JO  - Proceedings Electronic Components and Technology Conference

PY  - 2006/12/22

AU  - Ebbens S

AU  - Hutt DA

AU  - Liu C

ED  - 

DO  - DOI: 10.1109/ECTC.2006.1645911

VL  - 2006

SP  - 1847

EP  - 1852

Y2  - 2025/11/05

ER  -