TY  - CONF

T1  - Fabrication of complex 3D structures using Step and Flash Imprint Lithography (S-FIL)

JO  - Microelectronic Engineering

UR  - https://doi.org/10.1016/j.mee.2007.12.003

PY  - 2008/05/01

AU  - Kettle J

AU  - Hoyle RT

AU  - Dimov S

AU  - Perks RM

ED  - 

DO  - DOI: 10.1016/j.mee.2007.12.003

PB  - Elsevier BV

VL  - 85

IS  - 5-6

SP  - 853

EP  - 855

Y2  - 2026/09/13

ER  -