@article{article, title  = {{Analysis of Bond Wires and RF Compensation Circuits in E Band}},

 publisher = {{Institute of Electrical and Electronics Engineers (IEEE)}},

 url = {{https://doi.org/10.1109/tcpmt.2025.3594505 }},

 year = {{2025}},

 month = {{8}},

 author = {{Joseph SD and Ball EA}},

 doi = {{10.1109/tcpmt.2025.3594505}},

 journal = {{IEEE Transactions on Components, Packaging and Manufacturing Technology}},

 pages = {{1-1}},

 note = {{Accessed on 2025/08/27}}}