TY  - JOUR

T1  - Analysis of bondwires and RF compensation circuits in E-Band

JO  - IEEE Transactions on Components, Packaging and Manufacturing Technology

UR  - https://eprints.whiterose.ac.uk/id/eprint/233090

PY  - 2025/07/31

AU  - Joseph SD

AU  - Ball EA

ED  - 

DO  - DOI: 10.1109/tcpmt.2025.3594505

PB  - Institute of Electrical and Electronics Engineers (IEEE)

VL  - 15

IS  - 9

SP  - 1986

EP  - 1995

Y2  - 2025/12/01

ER  -