TY  - JOUR

T1  - Analysis of Bond Wires and RF Compensation Circuits in E Band

JO  - IEEE Transactions on Components, Packaging and Manufacturing Technology

UR  - https://doi.org/10.1109/tcpmt.2025.3594505

PY  - 2025/08/01

AU  - Joseph SD

AU  - Ball EA

ED  - 

DO  - DOI: 10.1109/tcpmt.2025.3594505

PB  - Institute of Electrical and Electronics Engineers (IEEE)

SP  - 1

EP  - 1

Y2  - 2025/08/27

ER  -