TY  - CONF

T1  - Size Changing Soft Modules for Temperature Regulated Self-assembly and Self-disassembly

JO  - 2022 IEEE 5th International Conference on Soft Robotics (RoboSoft)

UR  - https://doi.org/10.1109/robosoft54090.2022.9762093

PY  - 2022/04/04

AU  - Han J

AU  - Lahondes Q

AU  - Miyashita S

ED  - 

DO  - DOI: 10.1109/robosoft54090.2022.9762093

PB  - IEEE

SP  - 461

EP  - 466

Y2  - 2025/11/22

ER  -