@article{article, title  = {{Design, fabrication and preliminary characterization of a novel 3D Trench-Column Sensor implemented in 8-inch CMOS-compatible technology}},

 publisher = {{Institute of Electrical and Electronics Engineers (IEEE)}},

 url = {{https://doi.org/10.1109/tns.2025.3638892 }},

 year = {{2025}},

 month = {{11}},

 author = {{Liu M and Ji H and Cheng W and Liao C and Zhang L and Li Z and Tang B and Zhang P and Xiong W and Vickey T and Giulio Villani E et al}},

 doi = {{10.1109/tns.2025.3638892}},

 journal = {{IEEE Transactions on Nuclear Science}},

 pages = {{1-1}},

 note = {{Accessed on 2025/12/11}}}