TY  - JOUR

T1  - Design, fabrication and preliminary characterization of a novel 3D Trench-Column Sensor implemented in 8-inch CMOS-compatible technology

JO  - IEEE Transactions on Nuclear Science

UR  - https://doi.org/10.1109/tns.2025.3638892

PY  - 2025/11/28

AU  - Liu M

AU  - Ji H

AU  - Cheng W

AU  - Liao C

AU  - Zhang L

AU  - Li Z

AU  - Tang B

AU  - Zhang P

AU  - Xiong W

AU  - Vickey T

AU  - Giulio Villani E et al

ED  - 

DO  - DOI: 10.1109/tns.2025.3638892

PB  - Institute of Electrical and Electronics Engineers (IEEE)

SP  - 1

EP  - 1

Y2  - 2025/12/11

ER  -