@inproceedings{inproceedings, title  = {{Use of wafer backside inspection and SPR to address systemic tool and process issues}},

 publisher = {{SPIE}},

 url = {{https://doi.org/10.1117/12.846688 }},

 year = {{2010}},

 month = {{3}},

 author = {{Carlson A and Bachiraju P and Clark J and Trost D}},

 doi = {{10.1117/12.846688}},

 volume = {{7638}},

 journal = {{SPIE Proceedings}},

 pages = {{763818-763818}},

 note = {{Accessed on 2025/11/27}}}