@inproceedings{inproceedings, title  = {{Chip cracks during assembly: Finding and eliminating the critical defect}},

 publisher = {{IEEE}},

 url = {{https://doi.org/10.1109/ectc.2011.5898559 }},

 year = {{2011}},

 month = {{7}},

 author = {{Sauter W and Kaldor S and Clark J and Laforte S and McCarthy C and Restaino D and Casey J and Questad D}},

 doi = {{10.1109/ectc.2011.5898559}},

 journal = {{2011 IEEE 61st Electronic Components and Technology Conference (ECTC)}},

 pages = {{509-516}},

 note = {{Accessed on 2025/11/27}}}