@inproceedings{inproceedings, title  = {{3D printed bonds for Mmwave interconnects: a low-complexity, low-loss solution}},

 publisher = {{Institute of Electrical and Electronics Engineers (IEEE)}},

 url = {{https://eprints.whiterose.ac.uk/id/eprint/242378 }},

 year = {{2026}},

 month = {{3}},

 author = {{Joseph SD and Ball EA and Kettle J and Harwell J}},

 doi = {{10.1109/mapcon65020.2025.11426207}},

 isbn = {{9798331537234}},

 journal = {{2025 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON)}},

 note = {{Accessed on 2026/09/16}}}