@inproceedings{inproceedings, title  = {{3D Printed Bonds for Mmwave Interconnects: A Low-Complexity, Low-Loss Solution}},

 publisher = {{Institute of Electrical and Electronics Engineers (IEEE)}},

 url = {{}},

 year = {{2025}},

 month = {{12}},

 author = {{Joseph SD and Ball EA and Kettle J and Harwell J}},

 doi = {{10.1109/mapcon65020.2025.11426207}},

 volume = {{00}},

 pages = {{1-4}},

 note = {{Accessed on 2026/04/10}}}