TY  - CONF

T1  - 3D Printed Bonds for Mmwave Interconnects: A Low-Complexity, Low-Loss Solution

PY  - 2025/12/18

AU  - Joseph SD

AU  - Ball EA

AU  - Kettle J

AU  - Harwell J

ED  - 

DO  - DOI: 10.1109/mapcon65020.2025.11426207

PB  - Institute of Electrical and Electronics Engineers (IEEE)

VL  - 00

SP  - 1

EP  - 4

Y2  - 2026/04/10

ER  -