TY  - CONF

T1  - 3D printed bonds for Mmwave interconnects: a low-complexity, low-loss solution

JO  - 2025 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON)

UR  - https://eprints.whiterose.ac.uk/id/eprint/242378

PY  - 2026/03/16

AU  - Joseph SD

AU  - Ball EA

AU  - Kettle J

AU  - Harwell J

ED  - 

DO  - DOI: 10.1109/mapcon65020.2025.11426207

PB  - Institute of Electrical and Electronics Engineers (IEEE)

SN  - 9798331537234

Y2  - 2026/09/16

ER  -