TY  - CONF

T1  - Development and validation of functional imprint material for the step and flash imprint lithography process

JO  - Microelectronic Engineering

UR  - https://doi.org/10.1016/j.mee.2007.12.070

PY  - 2008/05/01

AU  - Kettle J

AU  - Coppo P

AU  - Lalev G

AU  - Tattershall C

AU  - Dimov S

AU  - Turner ML

ED  - 

DO  - DOI: 10.1016/j.mee.2007.12.070

PB  - Elsevier BV

VL  - 85

IS  - 5-6

SP  - 850

EP  - 852

Y2  - 2026/09/13

ER  -