TY  - JOUR

T1  - The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards

JO  - Journal of The Electrochemical Society

UR  - https://doi.org/10.1149/1.2069210

PY  - 2019/12/07

AU  - Gottesfeld S

AU  - Uribe FA

AU  - Armes SP

ED  - 

DO  - DOI: 10.1149/1.2069210

PB  - The Electrochemical Society

VL  - 139

IS  - 1

SP  - L14

EP  - L15

Y2  - 2025/11/02

ER  -