TY  - JOUR

T1  - Development of an Ag-Free Sn–Ti–Ni Solder for Low-Temperature Ultrasonic-Assisted Flux-Free Joining of Aluminium Alloys in Air

JO  - Metallurgical and Materials Transactions A

UR  - https://eprints.whiterose.ac.uk/id/eprint/245577

UR  - https://doi.org/10.1007/s11661-026-08352-3

PY  - 2026/09/01

AU  - Hardwick L

AU  - Kumar M

AU  - Xiao Y

AU  - Goodall R

ED  - 

DO  - DOI: 10.1007/s11661-026-08352-3

PB  - Springer Science and Business Media LLC

Y2  - 2026/09/23

ER  -