TY  - CONF

T1  - Analysis of bond wires and proposal for compensation circuits in 73 GHz applications

JO  - 2024 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON)

UR  - https://eprints.whiterose.ac.uk/id/eprint/225399

PY  - 2025/03/20

AU  - Joseph SD

AU  - Askre S

AU  - Ball EA

ED  - 

DO  - DOI: 10.1109/mapcon61407.2024.10923525

PB  - Institute of Electrical and Electronics Engineers (IEEE)

SN  - 9798350379709

Y2  - 2025/08/27

ER  -