TY  - CONF

T1  - Full-SiC integrated power module based on planar packaging technology for high efficiency power converters in aircraft applications

JO  - CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

UR  - https://eprints.whiterose.ac.uk/id/eprint/154712

UR  - https://ieeexplore.ieee.org/document/9097673

PY  - 2020/05/21

AU  - Raab O

AU  - Guacci M

AU  - Griffo A

AU  - Kriegel K

AU  - Heller M

AU  - Wang J

AU  - Bortis D

AU  - Schulz M

AU  - Kolar JW

ED  - 

PB  - VDE

SN  - 9783800752256

Y2  - 2025/11/10

ER  -