TY  - JOUR

T1  - Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning

JO  - Proceedings of the Electronic Packaging Technology Conference EPTC

PY  - 2006/12/01

AU  - Ebbens S

AU  - Hutt DA

AU  - Liu C

ED  - 

DO  - DOI: 10.1109/EPTC.2006.342689

SP  - 46

EP  - 52

Y2  - 2025/11/05

ER  -