TY  - CONF

T1  - Thermal cycling reliability of polycrystalline diamond and aluminium nitride substrates

JO  - 2014 International Symposium on Power Electronics, Electrical Drives, Automation and Motion

UR  - https://doi.org/10.1109/speedam.2014.6872061

PY  - 2014/01/01

AU  - Balakrishnan M

AU  - Sweet MR

AU  - Narayanan EMS

ED  - 

DO  - DOI: 10.1109/speedam.2014.6872061

PB  - IEEE

SP  - 128

EP  - 132

Y2  - 2025/11/24

ER  -